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 PRODUCT > Moudle Carrier |
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Introduction: SmarTEC® module carrier is a solution for valued and fragile devices. This packing is designed to protect delicate parts during transport, processing, inspecting and assembly and has been applied largely in many fields like optical materia-ls,opto-electronic component, semiconductor and optical communication.
SmarTEC® module carrier's structure consists of three cushions: the middle cushion which called module cushion can be customized to specific shape to hold the devices exactly and safely. Various cushion materials with different characteristics can be applied to meet specific requirements. |
IXPE Conductive Foam IXPE Conductive Foam is produced by compounding PE with carbon, then cross-linking by irradiation and foaming. The material has super conductivity to eliminate electrostatic permanently. Its independent, fine and close cells help to buffering and jolt-proof. Non-contaminating , non-corrosive and non-sloughing, low piercing force can ensure fragile and delicate parts to be inserted safely, cleanly and easily. IXPE foam is an ideal packing material for crystal, opto-electronic components, optical parts, glass, IC, PCB and delicate devices etc. |
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